Inkqubo yeTekhnoloji

  • I-10001
  • I-10003
  • I-10002

I-cylindrical grinding

I-cylindrical grinding (ikwabizwa ngokuba yiZiko lokuGcina i-Guinding) lisetyenziselwa ukugcuma kwindawo ye-cylindrical kunye namagxa emsebenzi. Umsebenzi owenziwa kumaziko axhonywe kumaziko kwaye ajikelezwe sisixhobo esaziwa ngokuba ngumqhubi weziko. Ivili elinevili kunye nomsebenzi ojikelezwe ziimotor ezahlukeneyo nakwizantya ezahlukeneyo. Itheyibhuli inokuhlengahlengiswa ukuba ivelise amaphetha. Intloko ye-WOP inokuthi icinyiwe. Iindidi ezintlanu ze-cylindricrical grinding zezi: i-Deameter engaphandle (OD) yokugaya, ngaphakathi kwedayimitha (i-id) yokugaya, ukutya okungenasiphelo, kunye nokugaya okungenasixhobo.

 

I-diameter yedayimitha

Ukugaya i-OD kukugaya okwenzeka kumhlaba wangaphandle abe yinto phakathi kwamaziko. Amaziko aphephe iiyunithi kunye nenqaku elivumela ukuba kujikelezwe into. Ivili lokugaya lijikelezwe kwicala elinye xa linxibelelana nento. Oku kuthetha ngokufezekileyo iindawo ezimbini ziya kutsala isikhombisi esichaseneyo xa unxibelelwano lwenziwe ukuba livumela umsebenzi oqhelekileyo kunye nethuba elingaphantsi kwejam phezulu.

 

I-Diameter engaphakathi

I-id yokugaya kukugaya okwenzeka ngaphakathi kwento. Ivili lokugaya lihlala lincinci kunobubanzi bento. Into ebanjelwe yi-collet, ejikeleza into endaweni. Kanye njengokuba u-Od Griinding, ivili lokugaya kunye nento ejikeleziweyo kwicala elikwindawo ejikelezayo yokudibana kwezinto ezimbini apho i-green.

 

Uxinzelelo lwe-cylindrical grinding lubanjelwe ngaphakathi ± 0.0005 intshi Umsebenzi wokuchaneka unokufikelela kwiimeko eziphezulu ± 0.00005 i-intshi (1.3 ~ 0.00001 intshi (0.25 μm) yomjikelo. Ukugqitywa komphezulu kungavela kwiimitha ezi-2 (i-51 NM) ukuya kwiimitha ezili-12,2 (3.2 μm), nge-microinch eqhelekileyo ukusuka kwi-8 ukuya kwi-6 ukuya kwi-0.81 μm)